施组设计下载简介：
内容预览随机截取了部分，仅供参考，下载文档齐全完整
江都建设项目施工方案2mm Sikafloor
Structure Profile:
Conductive layer
Sikafloor 220W
DB13(J)／T 267-2018标准下载Primer/scrape layer
System Description:
of the substrate. If those demand cannot be met, epoxy levelling layer is needed at additional cost.
需要指出的是，防静电自流平系统的施工队与基层平整度和粗糙度的要求很高，基面一定要光滑。
如果平整度和粗糙度都不能达到要求，需要额外增加环氧找平层对基层进行找平。
Detailed information please refer to attached datasheet of Skiafloor 156, 161, 220W, 262AS N.
材料的详细技术数据及施工细节参见所附说明书
Skiafloor 156, 161, 220W, 262AS N
Application Description:
Substrate Preparation
the whole floor will be shot blasted by blastrac blasting machine to remove surface laitance and to
provide fine roughness for good adhesion.
砂机进行喷砂处理，除去基层表面的浮浆层，以形成微糙面来提供与后续涂层的附着力。
Product & Consumption
Application Method
Substrate preparation
Cleaning, grinding and shot blasting
Rolling, scraping
Scrape Layer
Ref datasheet
Conductive Layer
Trowel, spike roller
further scrape and grind the floor to eliminate substrate defects and achieve a smooth surface.
用滚筒或刮板施工高性能无溶剂环氧底漆
。进一步对地面进行找补和打磨，以消除
基层缺陷，并提供一个光滑的受漆面。
Scrape layer
quartz sand, this operation will be finished in several times.
和石英砂配制的环氧砂浆批补地面，这一般要分好几次完成。
them to earthing point or steel column via earthing plate.
将自粘式导电铜箔以至少
的间距粘贴在批补层上，然后通过导电片将其同接地点或
Conductive layer
滚筒施工水性导电层材料
roll immediately in two directions with a spiked roller to remove entrapped air.
底漆固化后，进一步对地面进行打磨处理，然后使用锯齿刮板施工无溶剂自流平材料
石英砂，并随即用消泡滚筒消除气泡。
Normally 2 days for foot traffic, 7 days for full service.
JC／T 2346-2015标准下载Wall/ceiling epoxy coating
Structure Profile:
Wall/ceiling
Finish coat
Waterproof layer
SikaTop Seal 107
System Description:
太仓碧桂园测量放线施工方案（19P）.doc材料的详细技术数据及施工细节参见所附说明书